In micromachining, the use of ultra short pulses is an original solution adapted to the situations for which other technologies are put at fault. These other technologies are either already laser technologies (micro or nanosecond pulses, UV) or mechanical technologies (electroerosion). The performances of ultrafast processing are related to the specific nature of the laser matter interaction. The scientific studies indeed showed that, for example, the Zone Thermically Affected (ZAT) (zone around the laser radiation) is about micron size or lower for fs pulses, whereas this same ZAT is several tens of microns in the case of nanosecond pulses. Moreover energy of a femtosecond pulse being concentrated over a very short time, the instantaneous power reached can be very important (several Tera Watt). The ablation threshold of all materials is thus exceeded. The ultra short pulses thus allow very localised action, without damage of the untreated zones, and effective on very broad material range. Depending on the application, the beam shaping can lead to the realization of markings by engraving or modification of the internal structure of materials. In the first case, the depth can be controlled until a few hundreds of nanometers. The performed microstructures have controllable shapes (straight lines, curved, in 2,5D). Standard drillings have diameters of a few microns at least. The depths of drilling cannot exceed one mm thickness. This flexibility of use allow this type of surface structuring in very varied fields: function of assistance to the lubrication of frictions in tribology (by realization of surface micro cavity) or fluidic micro function for the realization of Lab-on-Chip (by realization of micro channels but also of guides of light for the selection and the detection of molecules).